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NCV8161BSN330T1G - onsemi

Description: Ultra High PSRR 90dB at 1kHz, 20mA; Ultra Low Output Noise 10µVRMS; Very Low Dropout 225mV@450mA; Ultra Low Quiescent current 18µA

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PCB Footprints
NCV8161BSN330T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 Case 483 Issue M
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NCV8161BSN330T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5 Case 483 Issue M
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NCV8161BSN330T1G Details

  • Manufacturer Part Number:

    NCV8161BSN330T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.305 V

  • Dropout Voltage1-Nom:

    1 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.000792%

  • Load Regulation-Max:

    0.092136%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.45 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    PMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.5 mm

NCV8161BSN330T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The NCV8161BSN330T1G has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use ESD-protective packaging. For latch-up prevention, ensure that the device is not exposed to excessive voltage or current, and use a latch-up immune design approach.
  • Yes, the NCV8161BSN330T1G is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions, and consider additional testing and validation for your specific application.
  • Use a systematic approach to troubleshoot issues. Check the device's operating conditions, PCB layout, and thermal design. Verify that the device is properly soldered and that there are no signs of physical damage. Use oscilloscopes or logic analyzers to monitor the device's behavior and identify potential issues.

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NCV8161BSN330T1G Overview

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