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NCV8163AMX330TBG - onsemi

Description: LDO Voltage Regulators XDFN4 AD 3.3V LDO 250 MA

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NCV8163AMX330TBG Details

  • Manufacturer Part Number:

    NCV8163AMX330TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    XDFN-4

  • Manufacturer Package Code:

    711AJ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    9.2

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.145 V

  • Dropout Voltage1-Nom:

    0.08 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    S-XDSO-N4

  • Length:

    1 mm

  • Line Regulation-Max:

    0.000792%

  • Load Regulation-Max(%):

    0.04108%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HXSON

  • Package Equivalence Code:

    SOLCC4,.04,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.43 mm

  • Surface Mount:

    YES

  • Technology:

    PMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1 mm

NCV8163AMX330TBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power handling at high temperatures.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure.
  • Yes, but ensure compliance with relevant industry standards (e.g., AEC-Q100) and perform thorough testing and validation.
  • Check for proper thermal sensing, ensure the device is not overheating, and verify that the thermal protection threshold is not set too low.

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NCV8163AMX330TBG Overview

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