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NCV8164AML180TCG - onsemi

Description: 1.6V to 5.5V input voltage; PSRR: 85 dB at 1 kHz; Low VDO at 2.8V @80mV max dropout; WDFN6 2 mm x 2 mm, DFNW8 3 mm x 3 mm, and TSOP-5; Ultra-Low Noise: 9µVRMS; 150C operating Junction temperature

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PCB Footprints
NCV8164AML180TCG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFNW8 3x3, 0.65P CASE 507AD
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3D Models
NCV8164AML180TCG - onsemi  - 3D model - Small Outline No-lead - DFNW8 3x3, 0.65P CASE 507AD
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NCV8164AML180TCG Details

  • Manufacturer Part Number:

    NCV8164AML180TCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-8

  • Manufacturer Package Code:

    507AD

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.275 V

  • Dropout Voltage1-Nom:

    0.165 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.3 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    3 mm

NCV8164AML180TCG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system.
  • The recommended soldering conditions for NCV8164AML180TCG are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering temperature profile that follows the JEDEC J-STD-020 standard.
  • To handle ESD protection during handling and assembly, use an ESD-protected workstation, wear an ESD strap, and handle the devices by the body or leads, rather than the pins. Also, ensure that all equipment and tools are ESD-compliant.
  • The recommended storage and handling conditions for NCV8164AML180TCG are: storage temperature of -40°C to 125°C, relative humidity of 60% or less, and protection from direct sunlight and moisture.

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