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NCV8165ML330TBG - onsemi

Description: Ultra High PSRR 85dB at 1 kHz, 63dB at 100 kHz; Ultra Low Output Noise 8.5 µVRMS; Ultra Low Quiescent current 12 µA; Operating Input Voltage Range 1.9V to 5.5V; Very Low Dropout 200mV at 500mA

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NCV8165ML330TBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFNW8 3x3, 0.65P
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NCV8165ML330TBG - onsemi  - 3D model - Small Outline No-lead - DFNW8 3x3, 0.65P
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NCV8165ML330TBG Details

  • Manufacturer Part Number:

    NCV8165ML330TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-8

  • Manufacturer Package Code:

    507AD

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.29 V

  • Dropout Voltage1-Nom:

    0.19 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    S-PDSO-N8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    3 mm

NCV8165ML330TBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the input voltage rises and falls monotonically, and that the enable pin is properly driven to prevent unwanted start-up or shutdown. A soft-start circuit can also be used to reduce inrush current.
  • Use a common-mode choke, X-capacitors, and Y-capacitors to filter out electromagnetic interference. The layout and placement of these components are critical to ensure effective EMI filtering.
  • Use a low-standby-power mode by setting the enable pin low when the device is not in use. Additionally, ensure that the input voltage is as low as possible while still meeting the device's operating requirements.
  • Ensure good thermal contact between the device and the heat sink, and use a thermal interface material to fill any gaps. The heat sink should be designed to dissipate heat efficiently, and the device should be placed in a location with good airflow.

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NCV8165ML330TBG Overview

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