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NCV8170AXV330T2G - onsemi

Description: Operating Input Voltage Range: 2.2V to 5.5V; Output Voltage Range: 1.2V to 3.6V (0.1V Steps); Ultra-Low Quiescent Current: Typ. 0.5 uA; Low Dropout: 170 mV Typ. at 150 mA output; High Output Voltage Accuracy: 1% Typ.; Stable with Ceramic Capacitors of 1 uF; Thermal Shutdown Protection; Automotive Qualified for NCV prefixes; Available in small 1x1mm xDFN4 package; Pb-Free Devices

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NCV8170AXV330T2G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - NCV8170AXV330T2G
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NCV8170AXV330T2G - onsemi  - 3D model - SO Transistor Flat Lead - NCV8170AXV330T2G
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NCV8170AXV330T2G Details

  • Manufacturer Part Number:

    NCV8170AXV330T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT563-6

  • Manufacturer Package Code:

    463A

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.25 V

  • Dropout Voltage1-Nom:

    0.18 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Length:

    1.6 mm

  • Line Regulation-Max:

    0.00792%

  • Load Regulation-Max:

    0.02%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSOF

  • Package Equivalence Code:

    FL6,.047,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.2 mm

NCV8170AXV330T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities at higher temperatures.
  • The NCV8170AXV330T2G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly to prevent damage. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • Yes, the NCV8170AXV330T2G is suitable for high-reliability and automotive applications. However, it's essential to review the device's AEC-Q100 qualification and to consult with onsemi's application engineers to ensure the device meets the specific requirements of your application.
  • To troubleshoot issues with the output voltage regulation, check the input voltage, output load, and feedback network. Ensure that the device is operated within its recommended operating conditions, and that the feedback network is properly configured.

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NCV8170AXV330T2G Overview

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