NCV8170BXV180T2G footprint, schematic symbol and 3D model by onsemi

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Part Number NCV8170BXV180T2G
Manufacturer onsemi
Pin Count 6
Part Category Integrated Circuit
Package Category SOT23 (6-Pin)
Footprint Name SOT23 (6-Pin) - SOT−563, 6 LEAD
Released Date Feb 5, 2019
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

NCV8170BXV180T2G Details

Manufacturer Part Number:
NCV8170BXV180T2G
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
SOT563-6
Manufacturer Package Code:
463A
Country Of Origin:
Malaysia
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
5 Weeks
Manufacturer:
onsemi
YTEOL:
6
Adjustability:
FIXED
Dropout Voltage1-Max:
0.5 V
Dropout Voltage1-Nom:
0.35 V
Input Voltage Absolute-Max:
6 V
Input Voltage-Max:
5.5 V
Input Voltage-Min:
2.2 V
JESD-30 Code:
R-PDSO-F6
JESD-609 Code:
e3
Length:
1.6 mm
Line Regulation-Max:
0.00972%
Load Regulation-Max:
0.02%
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Outputs:
1
Number of Terminals:
6
Operating Temperature TJ-Max:
125 °C
Operating Temperature TJ-Min:
-40 °C
Output Current1-Max:
0.15 A
Output Voltage1-Max:
1.836 V
Output Voltage1-Min:
1.764 V
Output Voltage1-Nom:
1.8 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
VSOF
Package Equivalence Code:
FL6,.047,20
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, VERY THIN PROFILE
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Regulator Type:
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Screening Level:
AEC-Q100
Seated Height-Max:
0.6 mm
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
FLAT
Terminal Pitch:
0.5 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Voltage Tolerance-Max:
2%
Width:
1.2 mm

NCV8170BXV180T2G Frequently Asked Questions (FAQs)

The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 20mm x 20mm, and using multiple vias to connect the thermal pad to the ground plane. Additionally, keeping the thermal pad away from other heat sources and using a thermal interface material (TIM) can help to improve thermal performance.
To ensure reliable operation in high-temperature environments, it is recommended to follow the derating guidelines provided in the datasheet, and to use a suitable heat sink or thermal management system. Additionally, ensuring good airflow and keeping the device away from other heat sources can help to reduce the operating temperature.
The recommended soldering conditions for the NCV8170BXV180T2G are a peak temperature of 260°C, with a dwell time of 10-30 seconds. It is also recommended to use a soldering iron with a temperature range of 220-240°C, and to avoid applying excessive force or pressure during the soldering process.
To prevent damage during storage and shipping, it is recommended to store the devices in their original packaging, and to avoid exposing them to extreme temperatures, humidity, or physical stress. Additionally, using anti-static packaging and handling the devices with anti-static wrist straps or mats can help to prevent electrostatic discharge (ESD) damage.
The recommended test and measurement equipment for characterizing the NCV8170BXV180T2G include a curve tracer or semiconductor parameter analyzer, a thermal chamber or temperature-controlled environment, and a high-precision multimeter or oscilloscope. Additionally, using a suitable test fixture or socket can help to ensure accurate and reliable measurements.

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NCV8170BXV180T2G Overview

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