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NCV8177AMTW090TCG - onsemi

Description: LDO Regulator Pos 0.9V 0.5A Automotive 8-Pin WDFN EP T/R

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NCV8177AMTW090TCG - onsemi - PCB symbol
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PCB Footprints
NCV8177AMTW090TCG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFNW8 2x2, 0.5P
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NCV8177AMTW090TCG - onsemi - 3D model - Small Outline No-lead - WDFNW8 2x2, 0.5P
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NCV8177AMTW090TCG Details

  • Manufacturer Part Number:

    NCV8177AMTW090TCG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WDFN-8

  • Manufacturer Package Code:

    511CL

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.6 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Line Regulation-Max:

    0.0051975%

  • Load Regulation-Max:

    0.01%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    0.9135 V

  • Output Voltage1-Min:

    0.8775 V

  • Output Voltage1-Nom:

    0.9 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2.5%

  • Width:

    2 mm

NCV8177AMTW090TCG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power handling capability according to the temperature derating curve provided in the datasheet.
  • The recommended soldering conditions for the NCV8177AMTW090TCG are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350-370°C. It's also essential to follow the recommended soldering profile and use a solder with a melting point above 217°C.
  • To troubleshoot issues related to the device's overcurrent protection feature, check the input voltage, output current, and sense resistor values. Ensure that the sense resistor is correctly connected and that the output current is within the specified limits. Also, verify that the device is not overheating, and that the thermal shutdown feature is not triggered.
  • To prevent ESD damage, it's recommended to handle the device with an ESD wrist strap or mat, and to use ESD-protected packaging and storage. Additionally, ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays, to protect the device from ESD events.

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NCV8177AMTW090TCG Overview

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