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NCV8187AMN180TAG - onsemi

Description: Low Vin 1.5 V; Ultra Low Noise 15 µVrms; High PSRR 75 dB at 1 kHz; Low Vout from 0.8 V; Power Good Signal; Available in DFN6 2x2 mm and DFN8 3x3mm packages; 150C operating Junction temperature

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NCV8187AMN180TAG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - NCV8187AMN180TAG
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NCV8187AMN180TAG Details

  • Manufacturer Part Number:

    NCV8187AMN180TAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-6

  • Package Description:

    WDFNW6, 6-PIN

  • Manufacturer Package Code:

    506DK

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2019-06-05

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.335 V

  • Dropout Voltage1-Nom:

    0.2 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.8 V

  • JESD-30 Code:

    S-PDSO-N6

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1.2 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.12,38

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.95 mm

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    2%

  • Width:

    3 mm

NCV8187AMN180TAG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 2x2 mm, using a 2-ounce copper layer, and ensuring a solid ground plane underneath the device. Additionally, it's recommended to use thermal vias to connect the thermal pad to the ground plane.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal interface material to reduce the thermal resistance between the device and the ambient environment.
  • Exceeding the maximum current rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within the recommended current rating to maintain reliability and performance.
  • To troubleshoot issues related to OVP and UVP, start by verifying the input voltage and ensuring it's within the recommended range. Check the device's pinout and ensure that the OVP and UVP pins are properly connected. If issues persist, consult the datasheet and application notes for guidance on troubleshooting and debugging.
  • To ensure EMC and EMI compliance, follow proper PCB layout and design practices, such as using a solid ground plane, minimizing loop areas, and using shielding or filtering components as needed. Additionally, consider using a common-mode choke or other EMI filtering components to reduce emissions and improve immunity.

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NCV8187AMN180TAG Overview

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