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NCV8187AMT180TAG - onsemi

Description: Low Vin 1.5 V; Ultra Low Noise 15 µVrms; High PSRR 75 dB at 1 kHz; Low Vout from 0.8 V; Power Good Signal; Available in DFN6 2x2 mm and DFN8 3x3mm packages; 150C operating Junction temperature

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PCB Footprints
NCV8187AMT180TAG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFN6 2x212
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3D Models
NCV8187AMT180TAG - onsemi  - 3D model - Small Outline No-lead - WDFN6 2x212
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NCV8187AMT180TAG Details

  • Manufacturer Part Number:

    NCV8187AMT180TAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Package Description:

    WDFNW6, 6-PIN

  • Manufacturer Package Code:

    511BR

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2019-06-05

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.335 V

  • Dropout Voltage1-Nom:

    0.2 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.8 V

  • JESD-30 Code:

    S-PDSO-N6

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1.2 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    2 mm

NCV8187AMT180TAG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good airflow around the device. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to reduce junction temperature.
  • The recommended soldering conditions for the NCV8187AMT180TAG are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350-370°C. It is also recommended to use a solder with a melting point of 217-220°C.
  • To handle ESD protection during handling and assembly, it is recommended to follow standard ESD handling procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Additionally, ensure that the device is stored in its original packaging or in an ESD-safe container when not in use.
  • Operating the device beyond its specified current rating can lead to reduced reliability, increased thermal stress, and potentially catastrophic failure. It is essential to ensure that the device is operated within its specified current rating to ensure reliable operation and to prevent damage to the device.

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NCV8187AMT180TAG Overview

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