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NCV86602BD50R2G - onsemi

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NCV86602BD50R2G - onsemi - PCB symbol
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NCV86602BD50R2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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NCV86602BD50R2G - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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NCV86602BD50R2G Details

  • Manufacturer Part Number:

    NCV86602BD50R2G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.6 V

  • Dropout Voltage1-Nom:

    1.2 V

  • Input Voltage Absolute-Max:

    40 V

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    4.5 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.04%

  • Load Regulation-Max:

    0.02%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    3.9 mm

NCV86602BD50R2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • The recommended input capacitors are X5R or X7R ceramic capacitors with a voltage rating of 50V or higher, and a capacitance value of 10uF to 22uF. The recommended output capacitors are also X5R or X7R ceramic capacitors with a voltage rating of 25V or higher, and a capacitance value of 10uF to 22uF.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback resistors. Ensure that the input voltage is within the recommended range, the output load is within the specified current limit, and the feedback resistors are correctly connected and of the correct value.
  • The recommended method for soldering this device is reflow soldering using a solder paste with a peak temperature of 260°C to 280°C. Hand soldering is not recommended due to the device's small size and high pin count.

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NCV86602BD50R2G Overview

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