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NCV8702MX33TCG - onsemi

Description: Obsolete - LDO Regulator, 200 mA, Ultra-Low Dropout, Ultra-Low Iq, High PSRR, Ultra-Low Noise

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NCV8702MX33TCG - onsemi PCB footprint - Other - Other - NCV8702MX33TCG-1
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NCV8702MX33TCG - onsemi  - 3D model - Other - NCV8702MX33TCG-1
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NCV8702MX33TCG Details

  • Manufacturer Part Number:

    NCV8702MX33TCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    XDFN6 1.5X1.5, 0.5P

  • Pin Count:

    6

  • Manufacturer Package Code:

    711AE

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2 V

  • JESD-30 Code:

    S-PDSO-N6

  • Length:

    1.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.45 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.5 mm

NCV8702MX33TCG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal shield to reduce the junction temperature.
  • The recommended input capacitors are X7R or X5R ceramic capacitors with a value of 10uF to 22uF, and the recommended output capacitors are X7R or X5R ceramic capacitors with a value of 10uF to 47uF. The capacitor selection should be based on the specific application requirements and operating conditions.
  • To troubleshoot issues with the device's enable pin, check the enable pin voltage and ensure it's within the recommended range. Verify that the enable pin is properly connected to a suitable pull-up or pull-down resistor, and that there are no signal integrity issues. Also, check the device's datasheet for specific enable pin requirements and recommendations.
  • Operating the device beyond its recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within its recommended voltage, current, and temperature ranges to guarantee reliable operation and prevent premature failure.

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