Description:30µA Operating Current at No Load; 50 mV Current Limit Sensing; Capable of 45 V Load Dump; Board Selectable Fixed Output Voltages With Lockout; 410 kHz Operating Frequency with synchronization capability; Adaptive Non−Overlap Circuitry; Integrated Spread Spectrum; Logic level Enable Input Can be Tied Directly to Battery; Short Circuit Protection Pulse Skip; Battery monitoring for UVLO and Overvoltage Protection; Thermal Shutdown (TSD); Adjustable Soft−Start; Individual Enable and Reset pins; QFN Package wit
The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the device, and using a thermal pad on the bottom of the package. A minimum of 2 oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
The critical parameters to monitor during operation to prevent overheating include the device junction temperature (TJ), output current (IO), and input voltage (VIN). It's also essential to monitor the device's thermal shutdown threshold and overcurrent protection features.
When selecting input and output capacitors, consider the device's input voltage range, output current, and switching frequency. Choose capacitors with a suitable voltage rating, capacitance value, and ESR (equivalent series resistance) to ensure stable operation and minimize noise.
The recommended soldering and rework conditions for this device include using a soldering iron with a temperature range of 250°C to 260°C, a soldering time of 3-5 seconds, and a peak reflow temperature of 260°C. It's also essential to follow the manufacturer's recommended rework procedures to avoid damaging the device.
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NCV881930MW00AR2G Overview
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