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NCV8856ADBR2G - onsemi

Description: Average Current Mode; 0.8 V Reference Voltage; 4.5 V to 38 V Input Range; Input Undervoltage Lockout; Low Quiescent Current in Sleep Mode; Internally controlled soft-start; Programmable Switching Frequency up to 500kHz; Switching Frequency can be Synchronized up to 600kHz; Average Output Current Limiting; Peak Output Current Limiting; 6.0 V Low-dropout Linear Regulator Auxiliary Output; Thermal Shutdown Protection; +/-2% Output Voltage Accuracy over temperature; -40 °C to 150 °C Operating Junction Temperatu

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NCV8856ADBR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−20 WB
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NCV8856ADBR2G - onsemi  - 3D model - Small Outline Packages - TSSOP−20 WB
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NCV8856ADBR2G Details

  • Manufacturer Part Number:

    NCV8856ADBR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-20 WB

  • Package Description:

    TSSOP-20

  • Manufacturer Package Code:

    948E

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    38 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    13.2 V

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    575 kHz

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

NCV8856ADBR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the IC and connect it to a heat sink or a thermal plane.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials and following proper soldering and assembly techniques.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To troubleshoot OVP and UVP issues, start by verifying the input voltage and ensuring it's within the recommended range. Check the voltage monitoring circuitry and ensure it's functioning correctly. Also, review the device's fault detection and protection mechanisms to identify the root cause of the issue.
  • To minimize EMC and EMI issues, follow proper PCB layout and design guidelines, use shielding and filtering components, and ensure that the device is properly grounded. Additionally, consider using EMI filters and common-mode chokes to reduce noise and interference.

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NCV8856ADBR2G Overview

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