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NCX2200GMAZ - NXP

Description: Analog Comparators NCX2200GM,o VEE (VEE = 0 V);VCC = 1.6 V to 5.5 V; VCM = 0.5VCC.

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Symbol
NCX2200GMAZ - NXP - PCB symbol
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PCB Footprints
NCX2200GMAZ - NXP PCB footprint - Other - Other - NCX2200GMAZ-2
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3D Models
NCX2200GMAZ - NXP - 3D model - Other - NCX2200GMAZ-2
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NCX2200GMAZ Details

  • Manufacturer Part Number:

    NCX2200GMAZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    XSON-6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Amplifier Type:

    COMPARATOR

  • Input Offset Voltage-Max:

    30000 µV

  • JESD-30 Code:

    R-PDSO-N6

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    800 ns

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max:

    0.009 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NCX2200GMAZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the specified temperature range (-40°C to 150°C).
  • Use a shielded enclosure, ensure proper grounding, and implement EMI filters on input/output lines. Follow NXP's recommended PCB layout and component placement guidelines.
  • Use the device's low-power modes, optimize the clock frequency, and minimize the number of active circuits. Implement power gating and dynamic voltage scaling where possible.
  • Use a 4-wire Kelvin connection for accurate voltage measurements. Ensure the device is properly powered and configured before testing. Follow NXP's recommended test procedures and guidelines.

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NCX2200GMAZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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