Description:Low Vf @ TJ:175 °C; No Reverse Recovery / No Forward Recovery; Max Junction Temperature 175°C; Avalanche Rated 166 mJ; High Surge Current Capacity; Positive Temperature Coefficient
The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power handling capability at high temperatures.
The maximum allowable voltage transient on the input pins is typically 10% above the maximum recommended operating voltage, but it's essential to consult with onsemi's application engineers for specific guidance on voltage transient tolerance.
Yes, the NDSH40120CDN is qualified for automotive and high-reliability applications. However, it's essential to consult with onsemi's application engineers to ensure that the device meets the specific requirements of your application, including AEC-Q101 qualification and PPAP documentation.
The recommended ESD protection for the NDSH40120CDN involves using a TVS diode or a dedicated ESD protection device on the input pins, in addition to following proper PCB design and handling practices to prevent ESD damage.
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NDSH40120CDN Overview
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