Description:Max Junction Temperature 175 °C; Avalanche Rated 380 mJ; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery; Low Vf @ TJ:175 °C
The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2 oz copper thickness, and ensuring good thermal conduction to the surrounding copper areas. A thermal via array can also be used to improve heat dissipation.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, ensuring good airflow, and minimizing power dissipation during operation.
The NDSH50120C has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. This includes using an ESD wrist strap, ESD mat, and ESD-safe packaging materials.
The NDSH50120C is not hermetically sealed, so it's not recommended for use in high-humidity environments. If operation in humid environments is necessary, consider using a conformal coating or potting the device to prevent moisture ingress.
The recommended soldering conditions for the NDSH50120C include a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that minimizes thermal stress on the device.
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NDSH50120C Overview
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