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NJM2737M-TE1 - Nisshinbo

Description: Operational Amplifiers - Op Amps Low Noise RRIO Dual OP Amp

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NJM2737M-TE1 - Nisshinbo PCB footprint - Small Outline Packages - Small Outline Packages - DMP8 HEIGHT 2
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NJM2737M-TE1 - Nisshinbo  - 3D model - Small Outline Packages - DMP8 HEIGHT 2
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NJM2737M-TE1 Details

  • Manufacturer Part Number:

    NJM2737M-TE1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DMP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nisshinbo Micro Devices

  • YTEOL:

    6.52

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.8 µA

  • Bias Current-Max (IIB) @25C:

    0.8 µA

  • Common-mode Reject Ratio-Nom:

    63 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    1.6 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2600

  • Voltage Gain-Min:

    1000

  • Wideband:

    NO

  • Width:

    5 mm

NJM2737M-TE1 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a heat sink if necessary, and ensure good thermal conductivity between the device and the PCB.
  • To prevent damage, handle the device by the body and avoid touching the pins, store it in an anti-static bag or wrap, and avoid exposing it to moisture, extreme temperatures, or physical stress.
  • The NJM2737M-TE1 is an automotive-grade device, but it's essential to check the specific requirements of the application, such as AEC-Q100 qualification, and ensure that the device meets those requirements.
  • To troubleshoot issues, check the input and output voltages, ensure proper PCB layout and thermal design, and verify that the device is operated within its recommended specifications. If issues persist, consult the datasheet or contact Nisshinbo Micro Devices' support team.

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NJM2737M-TE1 Overview

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