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NL17SV08XV5T2G - onsemi

Description: Extremely High Speed: tPD = 1.0 ns (Typ) at VCC = 3.3 V; Designed for 1.0 to 3.3 V Operation; Overvoltage Tolerance (OVT*) Input/Outputs Permits Logic Translation; Balanced ± 24 mA Output Drive @ 3.3 Volts; Near Zero Static Supply Current; Ultra-Tiny SOT-553 5 Pin Package, Only 1.6 x 1.6 mm Footprint, 1/3 the Footprint Area of a SOT-23; All Devices in Package SOT-553 are Inherently Pb-Free

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PCB Footprints
NL17SV08XV5T2G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT-553 CASE 463B ISSUE C
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3D Models
NL17SV08XV5T2G - onsemi  - 3D model - SO Transistor Flat Lead - SOT-553 CASE 463B ISSUE C
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NL17SV08XV5T2G Details

  • Manufacturer Part Number:

    NL17SV08XV5T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-553, 5 LEAD

  • Pin Count:

    5

  • Manufacturer Package Code:

    463B-01

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Family:

    AUP/ULP/V

  • JESD-30 Code:

    R-PDSO-F5

  • Length:

    1.6 mm

  • Load Capacitance (CL):

    30 pF

  • Logic IC Type:

    AND GATE

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    USSOF

  • Package Equivalence Code:

    FL5/6,.047,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, ULTRA THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.05 mA

  • Prop. Delay@Nom-Sup:

    3 ns

  • Propagation Delay (tpd):

    14.6 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.2 mm

NL17SV08XV5T2G Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for NL17SV08XV5T2G is 1.14V to 1.26V.
  • To ensure signal integrity, use a low-impedance PCB design, minimize trace lengths, and use termination resistors as needed. Also, ensure that the power supply is clean and stable.
  • The maximum clock frequency supported by NL17SV08XV5T2G is 800 MHz.
  • Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Also, follow the recommended thermal design guidelines in the datasheet.
  • The package type of NL17SV08XV5T2G is a 2.5mm x 2.5mm, 0.5mm pitch, 32-pin Very Thin Fine Pitch Ball Grid Array (VFBGA).

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