Please enter a minimum 3 letters or numbers
Technical Content
Part Image

NL17SZ07DBVT1G - onsemi

Description: • Designed for 1.65 V to 5.5 V VCC Operation • 2.1 ns tPD at VCC = 5 V (typ) • Input/Output Overvoltage Tolerant up to 5.5 V • IOFF Supports Partial Power Down Protection • Sink 24 mA at 3.0 V • Available in SC−88A, SC−74A, SOT−553, SOT−953 and UDFN6 Packages • Chip Complexity < 100 FETs • −Q Suffix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compli

Download NL17SZ07DBVT1G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
NL17SZ07DBVT1G - onsemi - PCB symbol
click to zoom
PCB Footprints
NL17SZ07DBVT1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC-74A
click to zoom
3D Models
NL17SZ07DBVT1G - onsemi - 3D model - SOT23 (5-Pin) - SC-74A
click to zoom

NL17SZ07DBVT1G Details

  • Manufacturer Part Number:

    NL17SZ07DBVT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-74A-5 3.00x1.50x0.95, 0.95P

  • Package Description:

    SC-74A, 5 PIN

  • Manufacturer Package Code:

    318BQ

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Propagation Delay (tpd):

    9.5 ns

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NL17SZ07DBVT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for NL17SZ07DBVT1G involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling, use a high-quality power supply with low ripple and noise, and add decoupling capacitors (e.g., 100nF and 10uF) close to the device. Also, use a 0.1uF capacitor between the VCC and GND pins to filter out high-frequency noise.
  • The maximum operating frequency of NL17SZ07DBVT1G is 200 MHz, but it can be overclocked up to 250 MHz with proper PCB design and cooling. However, exceeding the recommended frequency may reduce the device's lifespan and reliability.
  • To manage thermal issues, ensure good airflow around the device, use a heat sink or thermal pad, and avoid blocking the airflow around the device. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The NL17SZ07DBVT1G has built-in ESD protection, but it's still recommended to use external ESD protection devices (e.g., TVS diodes) to protect against electrostatic discharge. For latch-up prevention, use a latch-up immune design, and ensure that the device is powered up and down slowly to prevent latch-up conditions.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NL17SZ07DBVT1G Overview

Use the download button to access the NL17SZ07DBVT1G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NL17S, or try a keyword search, such as Gates

Parts related to NL17SZ07DBVT1G

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑