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NL17SZ08DFT2G-Q - onsemi

Description: Tiny SOT-353 and SOT-553 Packages; 2.7 ns TPD at 5 Volts (typ); Source/Sink 24 mA at 3.0 Volts; Over-voltage tolerant Inputs; Pin For Pin with NC7SZ08P5X, TC7SZ08FU and TC7SZ08AFE; Chip Complexity: FETs = 20; Designed for 1.65 V to 5.5 V VCC operation; Pb-Free Packages are Available; Wide Operating Vcc Range

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NL17SZ08DFT2G-Q - onsemi - PCB symbol
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PCB Footprints
NL17SZ08DFT2G-Q - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC-88A
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3D Models
NL17SZ08DFT2G-Q - onsemi - 3D model - SOT23 (5-Pin) - SC-88A
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NL17SZ08DFT2G-Q Details

  • Manufacturer Part Number:

    NL17SZ08DFT2G-Q

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88A / SC-70-5

  • Manufacturer Package Code:

    419A-02

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    AND GATE

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    5.5 ns

  • Propagation Delay (tpd):

    12.7 ns

  • Schmitt Trigger:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NL17SZ08DFT2G-Q Frequently Asked Questions (FAQs)

  • A good PCB layout for the NL17SZ08DFT2G-Q should consider signal integrity, power integrity, and thermal management. Keep the signal traces short, use a solid ground plane, and decouple the power pins with capacitors. Also, ensure good thermal conductivity by using a thermal pad and vias to dissipate heat.
  • The NL17SZ08DFT2G-Q requires a specific power-up and power-down sequencing to prevent damage. Power up the VCC pin first, followed by the VDD pin. When powering down, reverse the sequence. Ensure that the power supplies are stable and within the recommended voltage range before applying them to the device.
  • The NL17SZ08DFT2G-Q can operate up to 250 MHz, but the actual frequency limit depends on the system design, PCB layout, and signal quality. It's essential to consider the device's propagation delay, setup and hold times, and clock skew when designing the system.
  • To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, decoupling capacitors, and shielding. Also, consider the device's radiation pattern and take measures to reduce electromagnetic interference (EMI) and radio-frequency interference (RFI).
  • The NL17SZ08DFT2G-Q has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a thermal pad, vias, and a heat sink if necessary. Also, consider the device's power consumption and thermal resistance when designing the system.

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