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NL27WZ126USG - onsemi

Description: Designed for 2.3 V to 5.5 V VCC Operation; Extremely High Speed: tPD 2.6 ns (typical) at VCC = 5 V; Over Voltage Tolerant Inputs and Outputs; LVTTL Compatible - Interface Capability With 5 V TTL Logic with VCC = 3 V; LVCMOS Compatible; 24 mA Balanced Output Sink and Source Capability; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Replacement for NC7WZ126; Chip Complexity: FET = TBD; Pb-Free Package is Available

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NL27WZ126USG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - US8 US SUFFIIX CASE 493-02 ISSUE B
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NL27WZ126USG - onsemi  - 3D model - Small Outline Packages - US8 US SUFFIIX CASE 493-02 ISSUE B
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NL27WZ126USG Details

  • Manufacturer Part Number:

    NL27WZ126USG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    US8

  • Pin Count:

    8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.25

  • Control Type:

    ENABLE HIGH

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    27WZ

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    4.8 ns

  • Propagation Delay (tpd):

    13 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NL27WZ126USG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation.
  • Implement a robust power-on reset circuit, ensure a stable voltage supply, and consider using a thermistor or thermocouple to monitor temperature. Also, follow the recommended operating conditions and derating guidelines.
  • Use a shielded enclosure, keep sensitive traces away from the NL27WZ126USG, and use a common-mode choke or ferrite bead on the power lines. Ensure proper grounding and decoupling, and consider using a EMI filter or shielded cable.
  • Use a suitable power supply with a high current capability, and consider adding a soft-start circuit or inrush current limiter to reduce the startup current surge.
  • Ensure adequate heat sinking, consider using a heat sink or thermal interface material, and provide sufficient airflow. Also, consider the thermal impact on adjacent components and the overall system reliability.

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NL27WZ126USG Overview

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