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NL27WZ17DFT2G-Q - onsemi

Description: Designed for 1.65 V to 5.5 V VCC Operation; Extremely High Speed: tpd 2.0 ns (typical) at VCC = 5.0 V; Overvoltage Tolerant Inputs; LVTTL Compatible - Interface Capability with 5.0 V TTL Logic with VCC = 3.0 V (2.7-3.3); LVCMOS Compatible; 24 mA Balanced Output Sink and Source Capability at VCC = 3.0 V; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Chip Complexity: FET = 72; Equivalent Gate = 18; Hysteresis at the input for improved noise immunity

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Symbol
NL27WZ17DFT2G-Q - onsemi - PCB symbol
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PCB Footprints
NL27WZ17DFT2G-Q - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC−88*-1
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3D Models
NL27WZ17DFT2G-Q - onsemi - 3D model - SOT23 (6-Pin) - SC−88*-1
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NL27WZ17DFT2G-Q Details

  • Manufacturer Part Number:

    NL27WZ17DFT2G-Q

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88-6 / SC-70-6 / SOT-363-6

  • Package Description:

    SC-88, 6 PIN

  • Manufacturer Package Code:

    419B-02

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G6

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Inputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    7.5 ns

  • Propagation Delay (tpd):

    15.6 ns

  • Schmitt Trigger:

    YES

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NL27WZ17DFT2G-Q Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal management system, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • To prevent electrostatic discharge (ESD) damage, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design, such as TVS diodes or ESD protection arrays.
  • Yes, the NL27WZ17DFT2G-Q can be used in switching regulator applications, but it's essential to ensure that the device is operated within its recommended operating conditions, and to follow proper design and layout guidelines to minimize electromagnetic interference (EMI) and ensure reliable operation.
  • The recommended soldering conditions for the NL27WZ17DFT2G-Q are a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that follows the IPC J-STD-020 standard.

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