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NL27WZ17DFT2G - onsemi

Description: Designed for 1.65 V to 5.5 V VCC Operation; Extremely High Speed: tpd 2.0 ns (typical) at VCC = 5.0 V; Overvoltage Tolerant Inputs; LVTTL Compatible - Interface Capability with 5.0 V TTL Logic with VCC = 3.0 V (2.7-3.3); LVCMOS Compatible; 24 mA Balanced Output Sink and Source Capability at VCC = 3.0 V; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Chip Complexity: FET = 72; Equivalent Gate = 18; Hysteresis at the input for improved noise immunity

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PCB Footprints
NL27WZ17DFT2G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 419B−02
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NL27WZ17DFT2G - onsemi  - 3D model - SOT23 (6-Pin) - 419B−02
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NL27WZ17DFT2G Details

  • Manufacturer Part Number:

    NL27WZ17DFT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Package Description:

    SC-88, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.25

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G6

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Inputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    7.5 ns

  • Propagation Delay (tpd):

    15.6 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    YES

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NL27WZ17DFT2G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal via array under the package is recommended.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
  • The NL27WZ17DFT2G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2 kV human body model (HBM) and 250 V machine model (MM) ESD protection is recommended.
  • Yes, the NL27WZ17DFT2G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable.
  • The recommended soldering conditions are: peak temperature of 260°C, time above 217°C of 30 seconds, and a total process time of 60 seconds.

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NL27WZ17DFT2G Overview

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