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NLA9306MU3TCG - onsemi

Description: 2-bit Bidirectional Translator for SDA and SCL Lines in MixedMode I2C Bus Applications; StandardMode, FastMode, and FastMode Plus I2C Bus and SMBus Compatible; Less Than 1.5 ns Maximum Propagation Delay to Accommodate StandardMode and FastMode I2C Bus Devices and Multiple Masters; Allows Voltage Level Translation Between: 1.0 V Vref(1) and 1.8 V, 2.5 V, 3.3 V or 5 V Vbias(ref)(2) 1.2 V Vref(1) and 1.8 V, 2.5 V, 3.3 V or 5 V Vbias(ref)(2) 1.8 V Vref(1) and 3.3 V or 5 V Vbias(ref)(2) 2.5 V Vref(1) and 5 V Vbi

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NLA9306MU3TCG - onsemi - PCB symbol
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NLA9306MU3TCG - onsemi PCB footprint - Other - Other - NLA9306MU3TCG-1
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NLA9306MU3TCG - onsemi - 3D model - Other - NLA9306MU3TCG-1
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NLA9306MU3TCG Details

  • Manufacturer Part Number:

    NLA9306MU3TCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN-8

  • Package Description:

    UDFN-8

  • Manufacturer Package Code:

    517BZ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Delay-Max:

    3.3 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    1 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.04,14

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Nom:

    1 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.45 mm

NLA9306MU3TCG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the IC is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material (TIM) to improve heat transfer between the IC and the heat sink.
  • Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Also, ensure that the device is properly decoupled and that the power supply is well-regulated.
  • Check the input voltage, output voltage, and current sense resistor values. Verify that the device is properly configured and that the feedback loop is stable. Also, check for any signs of overheating or electrical overstress.
  • The device is rated for operation in humid environments, but it's essential to ensure that the PCB is properly coated and that the device is not exposed to condensing moisture. Consider using a conformal coating or potting the device for added protection.

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NLA9306MU3TCG Overview

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