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NLAS323USG - onsemi

Description: Dual SPST Analog Switch

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PCB Footprints
NLAS323USG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - US8 US SUFFIIX CASE 493-02 ISSUE B
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3D Models
NLAS323USG - onsemi  - 3D model - Small Outline Packages - US8 US SUFFIIX CASE 493-02 ISSUE B
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NLAS323USG Details

  • Manufacturer Part Number:

    NLAS323USG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    US8

  • Package Description:

    US-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    93 dB

  • On-state Resistance-Max (Ron):

    55 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Signal Current-Max:

    0.01 A

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    16 ns

  • Switch-on Time-Max:

    12 ns

  • Switching:

    MAKE-BEFORE-BREAK

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NLAS323USG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure good thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the junction temperature (TJ) and adjust the design accordingly.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage can cause permanent damage.
  • Yes, the NLAS323USG can be used in high-frequency applications up to 100 MHz. However, ensure proper PCB layout, decoupling, and signal integrity to minimize signal degradation.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input lines to protect the NLAS323USG from electrostatic discharge. Follow the recommended ESD protection circuitry in the datasheet.

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NLAS323USG Overview

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