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NLAS324USG - onsemi

Description: Dual SPST Analog Switch Low Voltage Single Supply

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NLAS324USG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - US8 US SUFFIIX CASE 493-02 ISSUE B
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NLAS324USG - onsemi  - 3D model - Small Outline Packages - US8 US SUFFIIX CASE 493-02 ISSUE B
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NLAS324USG Details

  • Manufacturer Part Number:

    NLAS324USG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    US8

  • Package Description:

    US-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    93 dB

  • On-state Resistance-Max (Ron):

    55 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    16 ns

  • Switch-on Time-Max:

    12 ns

  • Switching:

    MAKE-BEFORE-BREAK

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NLAS324USG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NLAS324USG involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and the GND pin to a solid ground plane. The input voltage should be within the recommended range of 2.7V to 5.5V. Additionally, ensure that the input and output capacitors are properly sized and placed close to the device.
  • The maximum power dissipation of the NLAS324USG is 250mW. However, this value can be affected by the operating temperature, voltage, and current. It's essential to calculate the power dissipation based on the specific application and ensure it's within the recommended limits.
  • The NLAS324USG is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the temperature coefficient and ensure the device is properly heat-sinked and cooled in high-temperature applications.
  • To troubleshoot issues with the NLAS324USG, start by verifying the power supply voltage, input and output signals, and PCB layout. Check for any signs of overheating, and ensure that the device is properly biased and terminated. Use oscilloscopes and signal generators to debug the circuit and identify the root cause of the issue.

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NLAS324USG Overview

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Part Image NLAS324US onsemi

SPST, 2 Func, 1 Channel, CMOS, PDSO8