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NLAS3699MN1R2G - onsemi

Description: Obsolete - Analog Switch, Dual DPDT, Ultra-Low RON

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PCB Footprints
NLAS3699MN1R2G - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN16 3x3, 0.5P CASE 485AE ISSUE C
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3D Models
NLAS3699MN1R2G - onsemi  - 3D model - Quad Flat No-Lead - QFN16 3x3, 0.5P CASE 485AE ISSUE C
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NLAS3699MN1R2G Details

  • Manufacturer Part Number:

    NLAS3699MN1R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN16 3x3, 0.5P

  • Package Description:

    QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    485AE

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    62 dB

  • On-state Resistance Match-Nom:

    0.06 Ω

  • On-state Resistance-Max (Ron):

    0.75 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.3 A

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    40 ns

  • Switch-on Time-Max:

    60 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NLAS3699MN1R2G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the package to dissipate heat effectively.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and provide adequate heat sinking and airflow around the device.
  • The recommended soldering conditions for the NLAS3699MN1R2G are a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that follows the IPC J-STD-020 standard.
  • Yes, the NLAS3699MN1R2G is designed to withstand vibrations up to 10G peak acceleration, but it's essential to follow proper mounting and soldering techniques to ensure reliable operation in high-vibration environments.
  • Common issues with the NLAS3699MN1R2G include overheating, electrical overstress, and soldering defects. To troubleshoot, check for proper thermal management, ensure correct voltage and current ratings, and inspect the solder joints for defects.

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NLAS3699MN1R2G Overview

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