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NLAS4684MR2G - onsemi

Description: Ultra-Low Resistance Dual SPDT Analog Switch

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NLAS4684MR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - Micro10 CASE 846B-03 ISSUE D
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NLAS4684MR2G - onsemi  - 3D model - Small Outline Packages - Micro10 CASE 846B-03 ISSUE D
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NLAS4684MR2G Details

  • Manufacturer Part Number:

    NLAS4684MR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    C/O FOR MICRO 10 PKG

  • Package Description:

    MICRO-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    846B

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    65 dB

  • On-state Resistance Match-Nom:

    0.06 Ω

  • On-state Resistance-Max (Ron):

    1 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    50 ns

  • Switch-on Time-Max:

    60 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NLAS4684MR2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Implement a proper thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid overheating the device.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. A 10uF input capacitor and a 22uF output capacitor are recommended.
  • Use a shielded inductor, keep the layout compact, and minimize loop areas. Add a common-mode choke and a Y-capacitor to reduce EMI.
  • The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device.

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NLAS4684MR2G Overview

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