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NLAS4783MN1R2G - onsemi

Description: Analog Switch ICs Triple SPDT Hi Speed 1ohm Sw. Ind. Temp

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PCB Footprints
NLAS4783MN1R2G - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN16 3x3 0.5 P CASE 485AE ISSUE A
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3D Models
NLAS4783MN1R2G - onsemi  - 3D model - Quad Flat No-Lead - QFN16 3x3 0.5 P CASE 485AE ISSUE A
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NLAS4783MN1R2G Details

  • Manufacturer Part Number:

    NLAS4783MN1R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN16 3x3, 0.5P

  • Package Description:

    QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    485AE

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    62 dB

  • On-state Resistance-Max (Ron):

    1 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSSOP

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.3 A

  • Supply Voltage-Max (Vsup):

    4.7 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    20 ns

  • Switch-on Time-Max:

    27 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NLAS4783MN1R2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability.
  • Yes, the NLAS4783MN1R2G is qualified for automotive and high-reliability applications. However, it is essential to follow the recommended design and manufacturing guidelines to ensure the device meets the required reliability standards.
  • Check the input voltage, output voltage, and current consumption to identify any anomalies. Verify that the device is properly decoupled and that the input voltage is within the recommended range. Consult the datasheet and application notes for troubleshooting guidelines.

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