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NLASB3157MTR2G - onsemi

Description: High Speed: tPD = 1.0 ns (Typ) at VCC = 5.0 V; Low Power Dissipation: ICC = 2.0 uA (Max) at TA = 25C; Standard CMOS Logic Levels; High Bandwidth, Improved Linearity; Switches Standard NTSC/PAL Video, Audio, SPDIF and HDTV; May be used for Clock Switching, Data Mux'ing, etc.; Low RDS(ON); Break Before Make Circuitry, Prevents Inadvertent Shorts; Can Switch Balanced Signal Pairs, e.g. LVDS > 200 Bits/Sec; Latchup Performance Exceeds 300 mA; Pin for Pin Drop in for NC7SB3157; Tiny SC88 Package Only 2.0 x 2.1 m

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PCB Footprints
NLASB3157MTR2G - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFN 6
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3D Models
NLASB3157MTR2G - onsemi  - 3D model - Small Outline No-lead - WDFN 6
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NLASB3157MTR2G Details

  • Manufacturer Part Number:

    NLASB3157MTR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WDFN6 1.2 x 1.0, 0.4P

  • Package Description:

    WDFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    506AS

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    1.2 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    57 dB

  • On-state Resistance Match-Nom:

    0.5 Ω

  • On-state Resistance-Max (Ron):

    15 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    SOLCC6,.04,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    13 ns

  • Switch-on Time-Max:

    24 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NLASB3157MTR2G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to onsemi's application note AND9173/D for more details.
  • Ensure the device operates within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • Follow standard ESD precautions during handling and assembly. Use an ESD wrist strap or mat, and ensure the device is stored in an anti-static bag or tube. onsemi recommends a human body model (HBM) of ±2 kV and a charged device model (CDM) of ±500 V.
  • Yes, the NLASB3157MTR2G is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and design guidelines to maintain reliability.
  • Verify the input voltage, output voltage, and load current are within the recommended specifications. Check for proper PCB layout, decoupling, and filtering. Consult onsemi's application notes and technical support resources for further assistance.

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