NLFV32T-101K-EF footprint, schematic symbol and 3D model by TDK

Symbol

click to zoom

PCB Footprints

NLFV32T-101K-EF - TDK PCB footprint - Inductor Moulded - Inductor Moulded - NLFV32T-101K-EF

click to zoom

3D Models

NLFV32T-101K-EF - TDK - 3D model - Inductor Moulded - NLFV32T-101K-EF

click to zoom

Datasheet Download Datasheet
Stock & Prices Price & Stock for NLFV32T-101K-EF
Part Number NLFV32T-101K-EF
Manufacturer TDK
Pin Count 2
Part Category Inductor
Package Category Inductor Moulded
Footprint Name Inductor Moulded - NLFV32T-101K-EF
Released Date Jun 24, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

NLFV32T-101K-EF Details

Manufacturer Part Number:
NLFV32T-101K-EF
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
CHIP
ECCN Code:
EAR99
HTS Code:
8504.50.80.00
Factory Lead Time:
10 Weeks
Manufacturer:
TDK Corporation
YTEOL:
6
Case/Size Code:
1210
Construction:
Rectangular
Core Material:
FERRITE
DC Resistance:
2.2 Ω
Inductance-Nom (L):
100 µH
Inductor Type:
GENERAL PURPOSE INDUCTOR
JESD-609 Code:
e4
Number of Functions:
1
Number of Terminals:
2
Operating Temperature-Max:
105 °C
Operating Temperature-Min:
-40 °C
Package Height:
2.2 mm
Package Length:
3.2 mm
Package Style:
SMT
Package Width:
2.5 mm
Packing Method:
TR, Blister Plastic, 7 Inch
Rated Current-Max:
0.055 A
Shape/Size Description:
RECTANGULAR PACKAGE
Shielded:
YES
Special Feature:
DC RESISTANCE IS MEASURED AT :20%
Surface Mount:
YES
Terminal Finish:
SILVER PLATINUM
Terminal Placement:
DUAL ENDED
Terminal Shape:
WRAPAROUND
Test Frequency:
0.796 MHz
Tolerance:
10%

NLFV32T-101K-EF Frequently Asked Questions (FAQs)

The recommended land pattern for the NLFV32T-101K-EF can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 2.5mm x 1.6mm and a 0.5mm hole in the center for the component's terminal.
The NLFV32T-101K-EF is a moisture-sensitive device. It's recommended to store it in a dry environment (less than 20% RH) and handle it according to the IPC/JEDEC J-STD-033 standard. Baking the component before reflow soldering is also recommended to prevent moisture-related issues.
The maximum reflow temperature for the NLFV32T-101K-EF is 260°C. It's essential to follow the recommended reflow profile to prevent damage to the component.
The NLFV32T-101K-EF is designed to withstand moderate vibration levels. However, it's recommended to consult with TDK Corporation or a qualified engineer to determine the component's suitability for high-vibration applications.
The ESR of the NLFV32T-101K-EF is not explicitly stated in the datasheet. However, according to TDK Corporation's application notes, the ESR is typically around 0.05 ohms. For more accurate information, consult with TDK Corporation or a qualified engineer.

Trust Checks

Manufacturer Collaborated

System Verified

Community Approved

NLFV32T-101K-EF Overview

Use the download button to access the NLFV32T-101K-EF schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like NLFV3, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

Parts related to NLFV32T-101K-EF

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →

NLFV32T-101K-EF - TDK

NLFV32T-101K-EF Details

NLFV32T-101K-EF Frequently Asked Questions (FAQs)

Trust Checks

NLFV32T-101K-EF Overview

About TDK

Parts related to NLFV32T-101K-EF