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NLFV32T-330K-EF - TDK

Description: Inductor Power Shielded/Molded Wirewound 33uH 10% 2.52MHz 10Q-Factor Ferrite 0.095A 0.78Ohm DCR 1210 T/R

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PCB Footprints
NLFV32T-330K-EF - TDK PCB footprint - Inductor Moulded - Inductor Moulded - NLFV32T-1
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3D Models
NLFV32T-330K-EF - TDK  - 3D model - Inductor Moulded - NLFV32T-1
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NLFV32T-330K-EF Details

  • Manufacturer Part Number:

    NLFV32T-330K-EF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.65 Ω

  • Inductance-Nom (L):

    33 µH

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e4

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.2 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Blister Plastic, 7 Inch

  • Rated Current-Max:

    0.095 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT :20%

  • Surface Mount:

    YES

  • Terminal Finish:

    SILVER PLATINUM

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2.52 MHz

  • Tolerance:

    10%

NLFV32T-330K-EF Frequently Asked Questions (FAQs)

  • The recommended land pattern for NLFV32T-330K-EF can be found in the TDK Corporation's recommended footprint document or by contacting TDK's technical support. The land pattern should be designed to ensure proper soldering and thermal management.
  • The thermal derating of NLFV32T-330K-EF should be handled by following the guidelines provided in the datasheet. The inductor's current rating decreases as the ambient temperature increases. Ensure that the inductor is operated within the recommended temperature range to avoid overheating and premature failure.
  • The recommended soldering profile for NLFV32T-330K-EF can be found in the TDK Corporation's soldering guidelines document or by contacting TDK's technical support. A typical reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended.
  • Yes, NLFV32T-330K-EF is designed to withstand vibrations up to 10G (10 Hz to 2000 Hz). However, it's recommended to perform additional testing and validation to ensure the inductor meets the specific vibration requirements of your application.
  • To ensure the magnetic shielding of NLFV32T-330K-EF, follow the recommended PCB layout guidelines and keep the inductor away from other magnetic components. Additionally, consider using a magnetic shield or a mu-metal shield to minimize electromagnetic interference (EMI).

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NLFV32T-330K-EF Overview

Use the download button to access the NLFV32T-330K-EF schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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