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NLHV4157NDFT2G - onsemi

Description: Operating Voltage Range; Switch Signal Voltage Range; Positive Control Signal Voltage; Low ON Resistance; Latch−up Performance; Small Packaging; These Devices are Pb−Free, Halogen−Free/BFR-Free and are RoHS−Compliant

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PCB Footprints
NLHV4157NDFT2G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE Y
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3D Models
NLHV4157NDFT2G - onsemi  - 3D model - SOT23 (6-Pin) - SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE Y
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NLHV4157NDFT2G Details

  • Manufacturer Part Number:

    NLHV4157NDFT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88-6 / SC-70-6 / SOT-363-6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.38

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -12 V

  • Neg Supply Voltage-Min (Vsup):

    -4 V

  • Neg Supply Voltage-Nom (Vsup):

    -6 V

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    33 dB

  • On-state Resistance Match-Nom:

    0.2 Ω

  • On-state Resistance-Max (Ron):

    15 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.05 A

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    225 ns

  • Switch-on Time-Max:

    220 ns

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NLHV4157NDFT2G Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central thermal pad connected to a large copper area on the PCB is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • To ensure SOA compliance, calculate the maximum allowed drain-source voltage and current based on the application's requirements. Then, verify that the MOSFET's operating conditions are within the SOA boundaries specified in the datasheet.
  • When paralleling multiple devices, ensure that each device has its own gate resistor and that the gate drive signals are synchronized. Also, consider the current sharing and thermal management implications to avoid uneven stress and potential failures.
  • To handle the high peak current capability, ensure that the PCB traces and components can handle the high current surges. Also, consider adding current limiting or surge protection components to prevent damage to the MOSFET or other components.
  • To prevent electrostatic discharge (ESD) damage, handle the devices with ESD-protective equipment, and ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays.

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NLHV4157NDFT2G Overview

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Part Image NLHV3157NDFT2G onsemi

SPDT, 1 Func, CMOS, PDSO6