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NLSF3T125MNR2G - onsemi

Description: Quad Bus Buffer with 3-state Control Inputs

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PCB Footprints
NLSF3T125MNR2G - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN16 3x3, 0.5P CASE 485G ISSUE G
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NLSF3T125MNR2G - onsemi  - 3D model - Quad Flat No-Lead - QFN16 3x3, 0.5P CASE 485G ISSUE G
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NLSF3T125MNR2G Details

  • Manufacturer Part Number:

    NLSF3T125MNR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN16, 3x3, 0.5P

  • Package Description:

    QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    485G-01

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    3T

  • JESD-30 Code:

    S-XQCC-N16

  • Length:

    3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    4

  • Number of Ports:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    16 ns

  • Propagation Delay (tpd):

    13 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NLSF3T125MNR2G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NLSF3T125MNR2G is a 3x3mm QFN package with a 0.5mm pitch. The datasheet provides a recommended land pattern, but it's essential to consult the onsemi application note AND8093/D for detailed PCB design guidelines.
  • To ensure proper biasing, follow the recommended operating conditions in the datasheet. Typically, this involves connecting the VCC pin to a stable 1.2V to 1.8V power supply, and the VBIAS pin to a voltage source between 1.2V and VCC. Consult the datasheet and application notes for specific biasing requirements.
  • The NLSF3T125MNR2G has an operating temperature range of -40°C to 125°C. However, it's essential to note that the device's performance may degrade at higher temperatures, and the maximum junction temperature (TJ) should not exceed 150°C.
  • The NLSF3T125MNR2G has built-in ESD protection, but it's still crucial to follow proper ESD handling procedures when working with the device. Use an ESD wrist strap, mat, or workstation, and ensure that all equipment and tools are properly grounded.
  • Store the NLSF3T125MNR2G in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 30°C, and the relative humidity should be below 60%. Avoid storing the devices in conductive materials or near strong electromagnetic fields.

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