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NLSV1T244MUTBG - onsemi

Description: Voltage Level Translator Unidirectional 1 Circuit 1 Channel 6-UDFN (1.2x1) -40°C ~ 85°C 0.9 V ~ 4.5 V

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PCB Footprints
NLSV1T244MUTBG - onsemi PCB footprint - Other - Other - UDFN6, 1.20x1.00x0.50, 0.40P CASE 517AA ISSUE E_2025-1.1
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3D Models
NLSV1T244MUTBG - onsemi  - 3D model - Other - UDFN6, 1.20x1.00x0.50, 0.40P CASE 517AA ISSUE E_2025-1.1
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NLSV1T244MUTBG Details

  • Manufacturer Part Number:

    NLSV1T244MUTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    UDFN6, 1.2 x 1.0, 0.4P

  • Package Description:

    UDFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    517AA

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    1T

  • JESD-30 Code:

    R-XDSO-N12

  • JESD-609 Code:

    e4

  • Length:

    1.2 mm

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    75 mA

  • Prop. Delay@Nom-Sup:

    3.3 ns

  • Propagation Delay (tpd):

    17 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NLSV1T244MUTBG Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • The NLSV1T244MUTBG has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NLSV1T244MUTBG is AEC-Q101 qualified, making it suitable for automotive applications. However, it's essential to review the device's qualification data and ensure that it meets the specific requirements of your application.
  • Check the input voltage, output voltage, and output current to ensure they are within the recommended operating conditions. Verify that the device is properly connected and that the output capacitor is of sufficient value and type. Consult the datasheet and application notes for more information.

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