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NLSV1T34DFT2G - onsemi

Description: Wide VCCA and VCCB Operating Range: 0.9 V to 4.5 V; High-Speed w/ Balanced Propagation Delay; Inputs and Outputs have OVT Protection to 4.5 V; Non-preferential VCCA and VCCB Sequencing; Power-Off Protection; UltraSmall Packaging: 1.45 mm x 1.0 mm ULLGA6 2.0 mm x 2.1 mm SC88A 1.2 mm x 1.0 mm UDFN6 1.45 mm x 1.0 mm UDFN6; This is a Pb and Halide Free Device

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PCB Footprints
NLSV1T34DFT2G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC-88A SOT-353 CASE 419A-02
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NLSV1T34DFT2G - onsemi  - 3D model - SOT23 (5-Pin) - SC-88A SOT-353 CASE 419A-02
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NLSV1T34DFT2G Details

  • Manufacturer Part Number:

    NLSV1T34DFT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-88A (SC-70-5 / SOT-353)

  • Package Description:

    5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    419A-02

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW/HIGH

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    1T

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.002 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.004 mA

  • Prop. Delay@Nom-Sup:

    3.3 ns

  • Propagation Delay (tpd):

    3.3 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NLSV1T34DFT2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering and hand soldering.
  • Use an ESD-protected workstation, wear an ESD strap, and handle the device by the body or pins, avoiding direct contact with the die. Implement ESD protection circuits in the design.
  • Operating beyond recommended conditions can reduce the device's lifespan, increase the risk of thermal runaway, and affect overall reliability. Ensure operation within specified limits.

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