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NLSV4T244MUTAG - onsemi

Description: VCCA and VCCB Operating Range: 0.9 V to 4.5 V; High-Speed w/ Balanced Propagation Delay; Inputs and Outputs have OVT Protection to 4.5 V; Non-preferential VCCA and VCCB Sequencing; Outputs at 3-State until Active VCC is Reached; Power-Off Protection; Outputs Switch to 3-State with VCCB at GND; Ultra-Small Packaging: 1.7 mm x 2.0 mm UQFN12; This is a Pb-Free Device

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NLSV4T244MUTAG - onsemi PCB footprint - Other - Other - NLSV4T244MUTAG-4
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NLSV4T244MUTAG Details

  • Manufacturer Part Number:

    NLSV4T244MUTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    UQFN12 2.0x1.7, 0.4P

  • Package Description:

    UQFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    523AE

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    4T

  • JESD-30 Code:

    R-XQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC12,.07X.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    2.6 ns

  • Propagation Delay (tpd):

    3.3 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.7 mm

NLSV4T244MUTAG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum Tj rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to maintain reliability.
  • Follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protective package. The device itself has built-in ESD protection, but external precautions are still necessary.
  • When paralleling devices, ensure that each device has its own separate heat sink and thermal management. Also, consider the current sharing and thermal balancing between devices to prevent hotspots and ensure reliable operation.

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NLSV4T244MUTAG Overview

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Part Image NLVSV4T244MUTAG onsemi

Bus Driver, VSV Series, 1-Func, 4-Bit, True Output, QCC12

Part Image SLSV4T244MUTAG onsemi

Bus Driver, SLSV Series, 1-Func, 4-Bit, True Output, QCC12