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NLSX4373DR2G - onsemi

Description: Wide VCC Operating Range: 1.5V to 5.5V Wide VL Operating Range: 1.5V to 5.5V; High-Speed with 20 Mb/s Guaranteed Data Rates; Low BIt-to-bit skew; Small Packaging - 1.8 x 1.2 x 0.5mm UDFN8

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PCB Footprints
NLSX4373DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8-2020-1
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3D Models
NLSX4373DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8-2020-1
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NLSX4373DR2G Details

  • Manufacturer Part Number:

    NLSX4373DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Delay-Max:

    1000 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.001 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.5 V

  • Supply Voltage-Nom:

    1.8 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.5 V

  • Supply Voltage1-Nom:

    2.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NLSX4373DR2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Follow proper PCB design and handling practices to minimize ESD risks.
  • Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Ensure that the soldering iron is set to a low temperature and the device is not exposed to excessive heat or moisture.

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NLSX4373DR2G Overview

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