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NLV17SZ06DFT2G - onsemi

Description: Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V; Designed for 1.65 V to 5.5 V VCC Operation, CMOS compatible; Over Voltage Tolerant Inputs: Vin may be between 0 and 7V for VCC between 0.5 and 5.5V; TTL Compatible - Interface Capability with 5 V TTL Logic with VCC = 2.7V to 3.6V; 24 mA Output Sink Capability, pull up may be between 0 and 7V; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Chip Complexity: FET = 20; Tiny SOT-353; Pb-Free Packages are Available

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PCB Footprints
NLV17SZ06DFT2G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC−88A
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3D Models
NLV17SZ06DFT2G - onsemi  - 3D model - SOT23 (5-Pin) - SC−88A
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NLV17SZ06DFT2G Details

  • Manufacturer Part Number:

    NLV17SZ06DFT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-88A (SC-70-5 / SOT-353)

  • Package Description:

    SOT-353, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    419A-02

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    17SZ

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    INVERTER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    6 ns

  • Propagation Delay (tpd):

    12 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    1.25 mm

NLV17SZ06DFT2G Frequently Asked Questions (FAQs)

  • A good PCB layout for NLV17SZ06DFT2G involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 1uF, and to place the output capacitor close to the device. Additionally, the input voltage should be stable and within the recommended range.
  • The maximum ambient temperature range for NLV17SZ06DFT2G is -40°C to 125°C. However, the device can operate up to 150°C with derating.
  • Yes, NLV17SZ06DFT2G is suitable for high-reliability applications. It is manufactured using a proprietary BiCMOS process and is designed to meet the requirements of automotive and industrial applications.
  • To protect NLV17SZ06DFT2G from overvoltage and undervoltage conditions, it is recommended to use a voltage supervisor or a reset IC to monitor the input voltage and reset the device if it falls outside the recommended range.

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NLV17SZ06DFT2G Overview

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