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NLV9306USG - onsemi

Description: ONSEMI - NLV9306USG - Bidirectional Voltage Level Translator, 2 Inputs, 2ns, 0V to 5.5V, US8-8

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NLV9306USG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - US8 CASE 493 ISSUE K
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NLV9306USG - onsemi  - 3D model - Small Outline Packages - US8 CASE 493 ISSUE K
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NLV9306USG Details

  • Manufacturer Part Number:

    NLV9306USG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    US8

  • Package Description:

    US-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Delay-Max:

    3.3 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.11,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.8 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NLV9306USG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal path short and use a thermal pad on the bottom of the package.
  • Use a heat sink, ensure good airflow, and consider derating the device's power handling at high temperatures. Also, ensure the PCB is designed to handle thermal expansion and contraction.
  • Exceeding the maximum Tj rating can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure proper thermal management to stay within the recommended operating range.
  • Yes, the NLV9306USG is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure you follow the recommended design and testing guidelines for these applications.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.

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NLV9306USG Overview

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