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NLX2G17AMX1TCG - onsemi

Description: ON Semiconductor NLX2G17AMX1TCG, Dual-Channel Non-Inverting Schmitt Trigger CMOS Buffer, 6-Pin ULLGA

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NLX2G17AMX1TCG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - ULLGA6 1.45x1.0, 0.5P
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NLX2G17AMX1TCG - onsemi  - 3D model - Small Outline No-lead - ULLGA6 1.45x1.0, 0.5P
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NLX2G17AMX1TCG Details

  • Manufacturer Part Number:

    NLX2G17AMX1TCG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LGA

  • Package Description:

    1.45 X 1 MM, 0.50 MM PITCH, LEAD FREE, ULLGA-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    613AF

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    2G

  • JESD-30 Code:

    R-XDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.45 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.004 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Inputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,14

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    13 ns

  • Propagation Delay (tpd):

    15.6 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    YES

  • Seated Height-Max:

    0.4 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NLX2G17AMX1TCG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum TJ rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Also, ensure that the PCB is designed with ESD protection in mind, including the use of ESD-resistant components and connectors.
  • Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Ensure that the soldering process is done in a nitrogen atmosphere to prevent oxidation. Follow the recommended soldering profile to prevent damage to the device.

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