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NOIP1FN2000A-LTI - onsemi

Description: CMOS Image Sensor, 2.3 MP, Global Shutter LVDS Output, NIR Enhanced, Microlens, LGA package, sealed glass with protective tape (D263)

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NOIP1FN2000A-LTI Details

  • Manufacturer Part Number:

    NOIP1FN2000A-LTI

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LBGA-128

  • Manufacturer Package Code:

    715AB

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    GLOBAL SHUTTER; IT ALSO OPERATES AT 3.3 V NOMINAL SUPPLY VOLTAGE

  • Array Type:

    FRAME

  • Body Breadth:

    19 mm

  • Body Height:

    1.78 mm

  • Body Length or Diameter:

    19 mm

  • Dynamic Range:

    60 dB

  • Frame Rate:

    230 fps

  • Horizontal Pixel:

    1920

  • Master Clock:

    360 MHz

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Current-Max:

    140 mA

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optical Format:

    2/3 inch

  • Output Interface Type:

    4-WIRE INTERFACE

  • Output Type:

    DIGITAL OUTPUT

  • Package Shape/Style:

    SQUARE

  • Pixel Size:

    4.8X4.8 µm

  • Sensitivity (V/lx.s):

    7.5 V/lx.s

  • Sensors/Transducers Type:

    IMAGE SENSOR,CMOS

  • Spectral Response (nm):

    400-1000

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Surface Mount:

    YES

  • Termination Type:

    SOLDER

  • Vertical Pixel:

    1200

NOIP1FN2000A-LTI Frequently Asked Questions (FAQs)

  • A good PCB layout for NOIP1FN2000A-LTI involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and provide adequate heat sinking. The device should be operated within the specified junction temperature range, and the thermal design should be validated through thermal simulations and testing.
  • NOIP1FN2000A-LTI has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. The device should be handled in an ESD-controlled environment, and ESD-sensitive devices should be protected with ESD shielding bags or containers.
  • NOIP1FN2000A-LTI is designed for isolated applications, and using it in a non-isolated application may compromise its performance and reliability. If isolation is not required, a different device may be more suitable. Consult the datasheet and application notes for guidance on non-isolated applications.
  • To troubleshoot issues with NOIP1FN2000A-LTI, start by reviewing the datasheet and application notes, and verifying that the device is operated within the recommended conditions. Check for proper PCB layout, component selection, and assembly. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue, and consult onsemi's technical support resources if needed.

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NOIP1FN2000A-LTI Overview

Use the download button to access the NOIP1FN2000A-LTI 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like NOIP1, or try a keyword search, such as Image Sensors

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Part Image NOIP1SN2000A-LTI onsemi

CMOS Sensor, 1920 Horiz pixels, 1200 Vert pixels, 230fps, Square, Surface Mount