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NOIP1FN2000A-QTI - onsemi

Description: IP-CDS global shutter technology; True HW scalable family concept; High configurability; Fast adaptability; Multiple windowing; Higher frame rates; High Dynamic Range

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NOIP1FN2000A-QTI - onsemi PCB footprint - Other - Other - NOIP1FN2000A-QTI-3
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NOIP1FN2000A-QTI - onsemi  - 3D model - Other - NOIP1FN2000A-QTI-3
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NOIP1FN2000A-QTI Details

  • Manufacturer Part Number:

    NOIP1FN2000A-QTI

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LCC-84

  • Manufacturer Package Code:

    115BC

  • Country Of Origin:

    Thailand

  • Factory Lead Time:

    20 Weeks

  • Date Of Intro:

    2016-08-10

  • Manufacturer:

    onsemi

  • YTEOL:

    6.85

  • Additional Feature:

    GLOBAL SHUTTER; IT ALSO OPERATES AT 3.3 V NOMINAL SUPPLY VOLTAGE

  • Array Type:

    FRAME

  • Body Breadth:

    19 mm

  • Body Height:

    2.41 mm

  • Body Length or Diameter:

    19 mm

  • Dynamic Range:

    60 dB

  • Frame Rate:

    230 fps

  • Horizontal Pixel:

    1920

  • Master Clock:

    360 MHz

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Current-Max:

    140 mA

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optical Format:

    2/3 inch

  • Output Interface Type:

    4-WIRE INTERFACE

  • Output Type:

    DIGITAL OUTPUT

  • Package Shape/Style:

    SQUARE

  • Pixel Size:

    4.8X4.8 µm

  • Sensitivity (V/lx.s):

    7.5 V/lx.s

  • Sensors/Transducers Type:

    IMAGE SENSOR,CMOS

  • Spectral Response (nm):

    400-1000

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Surface Mount:

    YES

  • Termination Type:

    SOLDER

  • Vertical Pixel:

    1200

NOIP1FN2000A-QTI Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal via array under the package is recommended. The thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system to keep the junction temperature below 125°C. Use a heat sink or thermal interface material to improve heat dissipation.
  • A 10nF to 100nF input capacitance is recommended to filter out high-frequency noise and ensure stable operation. The input capacitance value may need to be adjusted based on the specific application and noise environment.
  • Use a shielded enclosure and ensure that the device is placed at least 1mm away from any metal objects. Implement a common-mode choke or ferrite bead on the input lines to filter out high-frequency noise. Use a ground plane and ensure that all components are properly decoupled.
  • A 10uF to 100uF output capacitance is recommended to filter out high-frequency noise and ensure stable output voltage. The output capacitance value may need to be adjusted based on the specific application and load requirements.

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NOIP1FN2000A-QTI Overview

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