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NRC12ZOTRF - NIC Components

Description: Res Thick Film 1206 0 Ohm Pad SMD T/R Automotive AEC-Q200

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NRC12ZOTRF - NIC Components - PCB symbol
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NRC12ZOTRF - NIC Components PCB footprint - Resistor Chip - Resistor Chip - NRC12ZOTRF
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NRC12ZOTRF - NIC Components - 3D model - Resistor Chip - NRC12ZOTRF
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NRC12ZOTRF Details

  • Manufacturer Part Number:

    NRC12ZOTRF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    NIC Components Corp

  • YTEOL:

    11

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.55 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistor Type:

    JUMPER

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

NRC12ZOTRF Frequently Asked Questions (FAQs)

  • The recommended land pattern for the NRC12ZOTRF can be found in the NIC Components Corp's application note or on their website. It typically includes a rectangular pad with a size of 1.5mm x 0.8mm and a thermal pad with a size of 2.5mm x 2.5mm.
  • The thermal pad of the NRC12ZOTRF should be connected to a copper plane on the PCB to ensure good thermal dissipation. A thermal via array can be used to connect the thermal pad to the copper plane.
  • The maximum operating temperature of the NRC12ZOTRF is 125°C, as specified in the datasheet. However, it's recommended to derate the component's power rating at higher temperatures to ensure reliable operation.
  • The NRC12ZOTRF is a surface-mount device and can be susceptible to vibration-induced failure. It's recommended to use a vibration-resistant mounting method, such as a screw-down or adhesive-mounted heat sink, to ensure reliable operation in high-vibration environments.
  • To ensure proper soldering of the NRC12ZOTRF, follow the recommended soldering profile and use a solder with a melting point below 260°C. Avoid applying excessive heat or force during the soldering process to prevent damage to the component.

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NRC12ZOTRF Overview

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For a full list of alternate parts for NRC12ZOTRF, check out Findchips.com