The recommended land pattern for NRS5010T100MMGF is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 1.0mm. It's also recommended to have a non-solder mask defined (NSMD) pad to prevent solder from flowing onto the adjacent components.
While the NRS5010T100MMGF is rated for operation up to 125°C, it's not recommended to use it in high-temperature environments above 105°C for extended periods. Prolonged exposure to high temperatures can affect the component's reliability and lifespan.
To prevent damage during assembly, handle the NRS5010T100MMGF by the edges, avoid touching the component's terminals, and use an anti-static wrist strap or mat. Also, ensure that the component is not subjected to excessive mechanical stress, bending, or twisting.
While it's possible to use a different solder alloy, it's not recommended. The recommended Sn96.5Ag3Cu0.5 solder alloy is optimized for the NRS5010T100MMGF's termination material and ensures reliable solder joints. Using a different alloy may affect the component's reliability and performance.
The recommended storage condition for NRS5010T100MMGF is in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity below 60%. Avoid storing the components in direct sunlight, high-temperature environments, or areas with high humidity.
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NRS5010T100MMGF Overview
Use the download button to access the NRS5010T100MMGF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NRS50,
or try a keyword search, such as Fixed Inductors
