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NRVB0540T1G - onsemi

Description: Guardring for Stress Protection; Very Low Forward Voltage; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics:; Reel Options: 3,000 per 7 inch reel / 8 mm tape; Reel Options: 10,000 per 13 inch reel / 8 mm tape; Device Marking: B4; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature f

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NRVB0540T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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NRVB0540T1G - onsemi  - 3D model - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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NRVB0540T1G Details

  • Manufacturer Part Number:

    NRVB0540T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    LEAD FREE, PLASTIC, 425-04, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.08

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.62 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    5.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    20 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVB0540T1G Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (−40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the NRVB0540T1G from electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.

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NRVB0540T1G Overview

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