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NRVB140ESFT1G - onsemi

Description: Guarding for Stress Protection; Low Reverse Leakage; 175C Operating Junction Temperature; Epoxy Meets UL 94 V0 @ 0.125 in; Package Designed for Optimal Automated Board Assembly; ESD Rating: (Human Body Model = 3B, Machine Model = M4); NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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NRVB140ESFT1G - onsemi PCB footprint - Other - Other - NRVB140ESFT1G-1
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NRVB140ESFT1G - onsemi  - 3D model - Other - NRVB140ESFT1G-1
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NRVB140ESFT1G Details

  • Manufacturer Part Number:

    NRVB140ESFT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123FL 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    498-01

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.51 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    30 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVB140ESFT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The maximum allowed voltage on the VIN pin is 5.5V. Exceeding this voltage may damage the device.
  • Yes, but ensure that the device is properly cooled and the maximum current rating is not exceeded. A heat sink may be necessary for high-current applications.
  • Check the input voltage, ensure the enable pin is properly biased, and verify that the device is not overheating. Also, check for any short circuits or incorrect PCB layout.

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NRVB140ESFT1G Overview

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