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NRVB30H100MFST1G - onsemi

Description: Low Power Loss / High Efficiency; New Package Provides Capability of Inspection and Probe After Board Mounting; Guardring for Stress Protection; Low Forward Voltage Drop; 175°C Operating Junction Temperature; Wettable Flacks Option Available; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These are Pb−Free and Halide−Free Devices

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PCB Footprints
NRVB30H100MFST1G - onsemi PCB footprint - Other - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE N_1
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NRVB30H100MFST1G - onsemi  - 3D model - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE N_1
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NRVB30H100MFST1G Details

  • Manufacturer Part Number:

    NRVB30H100MFST1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN5 5X6, 1.27P (SO 8FL)

  • Manufacturer Package Code:

    488AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    100 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVB30H100MFST1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the NRVB30H100MFST1G is a pad size of 5.0 mm x 4.5 mm with a 0.5 mm radius corner, and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure reliability in high-temperature applications, it is recommended to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good thermal design and heat sinking.
  • The maximum allowed voltage derating for the NRVB30H100MFST1G is 80% of the maximum rated voltage, which is 80% of 100V, or 80V.
  • Yes, the NRVB30H100MFST1G is suitable for high-frequency switching applications up to 1 MHz, but it is recommended to follow the recommended operating conditions and ensure proper thermal design and heat sinking.
  • To prevent damage, it is recommended to handle the NRVB30H100MFST1G by the body, avoid touching the leads or die, and store the device in a dry, cool place, away from direct sunlight and moisture.

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NRVB30H100MFST1G Overview

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