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NRVBB30H60CTT4G - onsemi

Description: Low Forward Voltage; High Surge Capacity; 175C Operating Junction Temperature; 30A Total (15A Per Diode Leg); AEC-Q101 Qualified and PPAP Capable; These are Pb-Free Packages; NRVBB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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NRVBB30H60CTT4G - onsemi PCB footprint - Other - Other - NRVBB30H60CTT4G-1
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NRVBB30H60CTT4G Details

  • Manufacturer Part Number:

    NRVBB30H60CTT4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK 2 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    418B-04

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    60 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.56 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    260 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    7.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    300 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVBB30H60CTT4G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the NRVBB30H60CTT4G is a 5x5mm QFN package with a 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask design guidelines.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the thermal design guidelines provided in the datasheet, including proper heat sinking, thermal interface material selection, and PCB design considerations.
  • The NRVBB30H60CTT4G has built-in ESD protection, but it is still recommended to follow proper ESD handling and storage procedures to prevent damage. The datasheet provides guidelines for ESD protection and handling.
  • Yes, the NRVBB30H60CTT4G is qualified for use in high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, it is recommended to consult with onsemi's application engineers to ensure the device meets the specific requirements of your application.
  • To troubleshoot issues with the NRVBB30H60CTT4G, it is recommended to follow a systematic approach, including reviewing the datasheet, checking the device's operating conditions, and using diagnostic tools such as oscilloscopes and logic analyzers. onsemi's application engineers can also provide support and guidance.

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