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NRVBB4030T4G - onsemi

Description: Last Shipments - Schottky Barrier Rectifier, H-Series, 100 V, 40 A

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Symbol
NRVBB4030T4G - onsemi - PCB symbol
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PCB Footprints
NRVBB4030T4G - onsemi PCB footprint - Other - Other - D2PAK 3 CASE 418B−04 ISSUE L
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3D Models
NRVBB4030T4G - onsemi - 3D model - Other - D2PAK 3 CASE 418B−04 ISSUE L
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NRVBB4030T4G Details

  • Manufacturer Part Number:

    NRVBB4030T4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK 2 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    418B-04

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Application:

    POWER

  • Breakdown Voltage-Min:

    30 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    40 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    350 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVBB4030T4G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • The device has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2kV human body model (HBM) and 200V machine model (MM) ESD protection is recommended.
  • Yes, the NRVBB4030T4G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
  • The optimal gate resistor value depends on the specific application and switching frequency. A general guideline is to use a value between 10Ω and 100Ω. However, it is recommended to consult the application note or contact onsemi support for specific guidance.

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NRVBB4030T4G Overview

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